Another method is to use a special low melting point solder like Chipquik and melt/alloy it with the existing solder lowering the melting point drastically allowing the solder joints to remain molten long enough to easily remove the through hole component. Use a solder sucker to clean up the plated through hole and pad after. Its important to remove the low melting point alloy before soldering in the replacement part. This usually works well with low probability of damaging pads, tracks and plated through holes. When thermal relief pads aren't used it can be useful to preheat the board to 100C or so. The chipquik alloy is relatively expensive but not much is required to facilitate desoldering each joint. Bruce
On 24 October 2017 at 21:13 "jdd@dodin.org"
wrote: Le 24/10/2017 à 09:42, Dave Plater a écrit :
hitched up to a vacuum cleaner. Caps have two legs and multilayer boards are difficult to desolder.
may be better do not desolder but cut the thread under the capacitor and solder on the remaining parts
jdd
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