14 Oct
2004
14 Oct
'04
23:01
The Thursday 2004-10-14 at 09:29 -0400, James Knott wrote:
The new thing (for new chips to be) seems to bee coolant flowed _inside_ the chip, at just the boiling point of the coolant. It evaporate faster precisely on those regions of the chip which are hotter, thus keeping an uniform temperature on all the surface.
That's been around for years. About 8 or 9 years ago, I saw a chip from IBM, that used liquid cooling. A similar systems has been used for decades, with high power vacuum tubes and even some antique cars used it.
I think that not quite... I mean inside the chip, in contact with the silicon itself. I saw the technical report somewhere, perhaps in the ieee spectrum. -- Cheers, Carlos Robinson