14 Oct
2004
14 Oct
'04
23:39
On Thursday 14 October 2004 18:01, Carlos E. R. wrote:
decades, with high power vacuum tubes and even some antique cars used it.
I think that not quite... I mean inside the chip, in contact with the silicon itself. I saw the technical report somewhere, perhaps in the ieee spectrum.
-- Cheers, Carlos Robinson
IBM has done that since before 1990. They have used Helium under pressure for it's high thermal conductivity inside their "Thermal Conduction Modules". PeterB -- Using SUSE since 5.2 Loving SUSE 9.1 Pro My Blog: http://vancampen.org/blog --