On Friday 15 Oct 2004 00:39, Peter B Van Campen wrote:
On Thursday 14 October 2004 18:01, Carlos E. R. wrote:
decades, with high power vacuum tubes and even some antique cars used it.
I think that not quite... I mean inside the chip, in contact with the silicon itself. I saw the technical report somewhere, perhaps in the ieee spectrum.
-- Cheers, Carlos Robinson
IBM has done that since before 1990. They have used Helium under pressure for it's high thermal conductivity inside their "Thermal Conduction Modules".
PeterB --
Using SUSE since 5.2 Loving SUSE 9.1 Pro
My Blog: http://vancampen.org/blog
-- Hummmmmmm yes please I'll have some of that here please might keep this thing from frying itself at the first chance then and the darn graphics chip .
Pete . -- Linux user No: 256242 Machine No: 139931 G6NJR Pete also MSA registered "Quinton 11" A Linux Only area Happy bug hunting M$ clan, The time is here to FORGET that M$ Corp ever existed the world does not NEED M$ Corp the world has NO USE for M$ Corp it is time to END M$ Corp , Play time is over folks time for action approaches at an alarming pace the death knell for M$ Copr has been sounded . Termination time is around the corner ..